技術研發

Sankou Technology Corporation is being supported by an outstanding R&D team, and with a great deal of budget injection into our R&D activities every year, we are always keeping our ambitions in advancing of our technologies as a leader. Our company is now applying for multiple patents regarding our innovative technologies and thus maintaining our competitive advantage and future growth, with an aim to satisfy our customers with their future requirements by providing of innovative testing solutions,

LONGLIFE serial products is manufactured with first class chips shipped by the leading brands in Taiwan, while the seating boards of LED lamp are manufactured with the unique Chip On Heat Sinks, COHS, that have been ranked as the optimal heat emission manner for LED; also, such heat emission technologies has features as 40 patents, refine quality and the best of the heat emission structures worldwide. Furthermore, such products satisfy the requirements for environmental protection and energy saving in this modern life: small volume, free of mercury, low power consumption and long life cycle. We are providing of products 100% Made In Taiwan.

Core Technology：COHS®：Chips On Heat Sink

LED lifespan is related to working temperature

The Significance of Heat Emission

The optical performance of LEDs is not only related to their optical features, but also is under impacts from their junction temperatures. For designers of such products, heat management with default by overheating are always unavoidable challenges since nearly 80% of the energy within LEDs is ultimately in transfer as thermal energy. Both in theory and from experiments, we have seen evidences that the performance and life cycle of LEDs are closely related to PN junctions. As junction temperature inside the core metal of LEDs is in rising of every 10°C, the lumen is in reduction of every 1% and the life cycle is in shorting of every 50%; please refer to the figure as below:

What is "COHS" ?

1. COHS stands for “Chips On Heat Sink”
2. No other Thermal Resistances Between Chips and Heat Sink - Since Chips bond with Heat Sink Directly
3. Benefits: 1) Lowest Thermal Resistance
3.Benefits: 2) Easily to Control T-junction
3.Benefits: 3) Low Cost Packaging Structure
3.Benefits: 4) Flexible Design Capabilities

Current LED Packaging Structure
1. LED Chip
2. Sub-mount(Silicon)
3. Substrate(Plastic,PLCC,MCPCB...)
4. PCB Board(MCPCB)
5. Heat Sink

Current LED Package Issues
1. Improper material(low thermal conductivity),unable to dissipate heat from LED efficiently.
2. Ordinary SMT package,SMT is also a thermal resistance layer,not to mention the stability issue.
3. So called COB package,structures and materials are not optimized,LED hot spot is still the issue.
4. Without instant and efficient monitoring mechanism after LED modules are installd,final products are not well controlled together with quality issue.

Structure of "COHS"

Chips On Heat Sink - No other Thermal Resistances Between Chips and Heat Sink

Our power module have been certified by several famous systems worldwide, such as CE/ UL/ Fcc/ Rohs etc. as our best guarantee for the quality of our products. With our unique designs for easy-to-replace, our customers definitely will be benefited as a result.

LONGLIFE serial products offer a QA guarantee as less than 30% of lumen reduction within two years. Such guarantee is our innovation and still unique until now in the entire of industries. We suggest that replacement with LED products is a firm practice to protect our earth, in addition to its benefits in energy saving.